Geil Ultra X PC3200 BH5 - Details of Ultra X Memory
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The memory is shipped in individually sealed air tight antistatic bags which protects them during shipping until they can be installed in a system.
The first thing you will recognize is the unique packaging of the sticks. Geil ships the Ultra X modules sealed in individually sealed anti-static bags, in a unique blue acrylic container set around foam to reduce impact during shipping, or to possibly just look cool. Either way, it does provide some protection and makes them stand out in a crowd packaging memory sticks.
Once you remove the modules from their package and take them out of their anti-static bag, you will see even more quality. The sticks have tin coated platinum copper heat spreaders which have a mirror finish. Geil uses a special mounting technique to apply heat spreaders to the memory modules, making them permanently bonded to the modules. This leaves the heat spreaders without mounting clips, making these simple and clean looking modules.
Geil also places a temperature sticker that allows users to monitor the temperature of their memory modules and also place the Geil holomark logo to show the rated speed of the memory modules, the latency, and the model number, all to prevent counterfeiting, or users selling them off as higher rated sticks.
The temperature is located on the left of the memory modules and show the operating temperature of the memory.
The hologram logo has the speed and latencies printed over it to prevent counterfeiting.
The guts of the Geil Ultra X
Under the heat spreaders is what truly defines the performance characteristics of the Ultra X, the PCB and the Memory IC. The Ultra X uses a 6 layer Ultra Low Noises Shielded PCB with Gold 30u” Plating. This technology reduces the amount of electrical noise that is present in all high-speed ICs. This results in faster and more stable memory.
Geil has been producing the Ultra X with 2 different IC’s, some modules have Samsung TCCD memory modules while others have Winbond BH5 UTT, these really determine the overclocking headroom and latencies of the sticks. UTT BH5 memory modules are capable of running the lowest latencies possible, while TCCD can run considerably more relaxed timing at considerably faster clock speeds. Both modules have points where they excel, but in the end performance is barely noticeable in the real world.
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