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HARDWARE NEWS

Thermal Integration TI-RV104N
By: Tekime
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    2004-03-12

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    Thermal Integration TI-RV104N @ Frosty Tech

    "The forked-fins of this extruded aluminum heatsink make it pretty evolutionary for its class; especially considering Intel's recently announced bifurcated reference heatsink for the socket 775 Tejas-FMB1. The 'sun' shape of the Thermal Integration TI-RV104N, with copper in the center surrounded by aluminum, is a hint of what you can expect when computers make the switch to socket 775 - only the heatsink will be about 80mm in diameter. With a diameter that large, it leads me to wonder if plans aren't also in the works to come out with a Socket 754 Athlon64 version based on the TI-RV104N. In any case, it is too early for that so let's get started and see how the Thermal Integration TI-RV104N performs thermally, and acoustically!"

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    DISCLAIMER: The content provided in this article is not warranted or guaranteed by Developer Shed, Inc. The content provided is intended for entertainment and/or educational purposes in order to introduce to the reader key ideas, concepts, and/or product reviews. As such it is incumbent upon the reader to employ real-world tactics for security and implementation of best practices. We are not liable for any negative consequences that may result from implementing any information covered in our articles or tutorials. If this is a hardware review, it is not recommended to open and/or modify your hardware.

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